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This THERM-A-FORM™ CIP 30 U is a single component, urethane, dispensable thermal compound with 3.0 W/m-K thermal conductivity.
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THERM-A-GAP-GEL
This THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.
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Finding A Reliable Semiconductor Distributor In Singapore
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