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Category: Thermal Interface Materials

THERM-A-FOAM

January 10, 2024

THERM-A-FOAM

This THERM-A-FORM™ CIP 30 U is a single component, urethane, dispensable thermal compound with 3.0 W/m-K thermal conductivity.

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THERM-A-GAP-GEL

January 10, 2024

THERM-A-GAP-GEL

This THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.

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