Amphenol’s BergStak®, MezzoStak®, Conan®, ComboStak® and PowerStak® are industry proven board-to-board solutions. To enlarge the advantages of these recognized board-to-board solutions, we have expanded our offering with Flexible Printed Circuit (FPC) assemblies, which provide design flexibility to customers.
Flexible option for space constraint environments where PCBs are not an option
Comprehensive range of pitch sizes, positions and stack heights to satisfy all needs
High-speed performance up to 16Gb/s
Utilize SMT process with higher process consistency, and lower assembly cost
Fully customized solutions using all advantages of board-to-board connectors like mating reliability and different profile heights