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MOS FET relay is a non-contact relay used primarily for switching and connecting signals. It has mechanical relays and semiconductors features and is used in a semiconductor inspection system, various measurement devices, security equipment, and a wide range of other applications.
Top-selling items versatile in usage and perfect for the switching of small and analog signals. These products are a go-to choice for a multitude of applications.
Experience the power of MOS FET relays designed to deliver high load voltage, all compactly housed within a SOP4 pin package
Discover our MOS FET relays, boasting a multi-pole contact configuration (2a/2b/1a1b), ready to be integrated into a variety of circuits.
Experience MOS FET relays that offer low on-resistance and high-capacity switching, rivaling the performance of traditional mechanical relays.
These units allow for a substantial withstand voltage of 5,000VAC between input and output, all in a small DIP4 pin package. For those seeking even more precision, high-sensitivity models are also part of our offering.
MOS FET relays with a withstand voltage of 5,000VAC between input and output made possible by a DIP6 pin package
Experience MOS FET relays equipped with a self-protection feature (current limit), making them an excellent choice for guarding against overcurrent situations.
Discover our Low CxR type MOS FET relays, designed with a focus on semiconductor tester applications. They excel at reducing the product of C (capacity between output terminals) and R (output-on resistance). Explore our selection of models that emphasize minimal C and R for superior performance.
MOS FET relays that achieve high load voltage in a subminiature package
MOS FET relays that achieve high current in a subminiature package
Voltage-driven MOS FET relays with a built-in current limiting resistor on the input side
MOS FET Relay in module package with SPDT(1C) and 1 pA max. leakage current
Signal relays are mainly used for lower than 2A load switching, and can be used in various applications such as telecom & network devices, test and measurement equipment, and security devices.
Ultra-miniature, Highly Sensitive SPDT Relay for Signal Circuits
General-purpose, Low-cost, Two-pole Relays for Signal Circults
World's Standard Model G6A!
Subminiature, Sensitive SPDT Signal Switching Relay
Ultra-compact and Slim DPDT Relay
Surface Mounting Relay with the World’s Smallest Mounting Area
Global standard automotive Plug-in Relays (ISO Relays)
8-GHz Band Miniature DPDT High Frequency Relay for High-speed Differential Transmission Signal Switching
Compact, Industry-Standard 2-pole relay, designed to switch 2A Signal Loads.
Power relays for printed circuit boards offer superior performance in high-capacity load switching in the power supply system owing to its material that can resist to contact arc and single contact structure (see figure). These power relays also retain excellent performance in contact volume and contact pressure.
In addition, these power relays comply with various safety standards. The products line-up includes relays that have enhanced insulation distance between coil contacts
This is a relay that performs high-voltage and high-capacity urgent shutdown of DC circuits.
These relays not only energize DC circuit but also shutdown the high voltage circuit at high speed when an error occurs.
PCB Power Relays for high switching capacity
DC miniature power relays that enable DC load interruption at 12V and 24V
DC power relays that enable DC load interruption at high voltage and current
High switching current, Diversified Application latching relay
Miniature Basic Switches 27.8W×10.3D×15.9H
Subminiature Basic Switches 19.8W×6.4D×10.2H
Ultra Subminiature Basic Switches 12.8W×5.8D×6.5H
Sealed switch against water spray or excessive dust
Applications:
General purpose detection switches
Ultra subminiature SMD detection switches
Switches to detect door open/close
Switches to detect door open/close and to cut the power supply of industrial equipment.
Tactile switches for various operation panel
Compact construction with bright and uniform illumination
Dust proof tactile switch by sealed construction
SMD tactile switch suitable for high density mounting
Hinged design developed through ergonomics
Key tops for B3F, B3W and B3FS
Minimum size class in the industry Rocker switch with reset function
Minimum size class in the industry Remote Reset Rocker Switch with Delay OFF Function
Miniature Rocker Switch for High Capacity Switching
Rocker Switch with External Reset Function for High capacity Switching
Safety-considered Power Rocker Switch
Small pushbutton switches and indicators with 8 to 12mm diameter
Pushbutton Hand switch
Ultra subminiature toggle switches
Ultra subminiature pushbutton switches
DIP switch for various setting devices
DIP switch with up and down operation
Rotary DIP switch suitable for channel setting
The core of a printed circuit board connectors and MIL standard connectors
Crimped sockets for discrete wires join the MIL connector series
Easy-wire Connectors with e-CON specifications; Ideal for connecting sensor
SMT-compatible Connectors with a 1.27-mm Pitch
Terminal block PCB connectors suitable for controller interface.
Comprehensive product lineup based on the international DIN standard.
Contact pitch of 1.27 mm. Supports increments of 1 mm for stacking heights of 5 to 20 mm.
Rotary Backlock Connector (0.5-mm Pitch, 1.0-mm Pitch, Dual sided, Upper sided Contact) Rotary Backlock Connectors Provide Improved Insertion of FPC/FFC Cables and helps Confirm Proper Connection with Sure Lock Feel.
D-Sub connectors that are ideal for office equipment interfaces
USB-Compliant Interface Connectors.
IC Connectors have excellent reliability and can tolerate momentary Interruptions in power.
Socket for testing electronic devices that have a USB Type-C I/O connect
Low-profile Circuit Jumper Connectors
Experience precision and versatility with our products, ideal for diverse flow measurement requirements. Designed for high accuracy and a broad range of capabilities.
Achieve optimal air conditioning control without compromising on performance quality. Our airflow sensing solutions are designed to deliver energy efficiency without compromising on quality control.
Subminiature MEMS gauge pressure sensors with low power consumption.
The world's smallest class size, high-precision seismic sensor. IoT friendly.
Detecting vibration/fall by an earthquake quickly and making it possible to prevent second disaster.
Quickly detect earthquakes to help prevent secondary disasters. Auto-level mechanism enables mounting at ±5°
MEMS Non-Contact Thermal Sensor for Contactless Measurement
Sense a variety of environmental information
Sense a variety of environmental information
Six types of sensing functions
Temperature, humidity, light, barometric pressure, noise, acceleration
Transmissive types
Compact reflective model
Small optical sensors to detect the work
This sensor can detect various targets like transparent, mirror or black works.
Miniature long-distance diffuse reflective sensor that can be installed anywhere.
Reliable Detection of Changes and Differences in Color – Contributes to Automation of Equipment –
Real-time 3D sensing of distance to humans or objects
Higher resolution, ultra compact and suitable for paper thickness detection
Image sensing compo with 10 different image sensing functions to recognize people's conditions.
Reliable operation that requires only a light touch. Models equipped with anti-static FG terminals are also available.
Sensor evaluation board that supports open platform
OMRON can manufacture the world’s smallest class* testing sockets with a narrow pitch of 0.175mm
Camera and display modules, which are becoming more multifunctional through high-density mounting, are increasingly using narrower pin spacing. It is extremely difficult to inspect extremely small products with dozens of terminals arranged in a narrow pitch. However, the narrow-pitch compatible type, which is packed with OMRON’s technology, can realize highly accurate inspection even for extremely small and narrow-pitch products that require delicate handling.
Let OMRON take care of the inspection of extremely small and multi-terminal electronic components.
*According to our own research in March 2023
*Specifications are for reference only and may vary depending on the customized product.
Pogo pins are cylindrical in shape and occupy mounting space, making it difficult to place them side by side at a pitch of 0.35mm or less. Forcibly making the size to be smaller will make it less durable, and the pin will break immediately. However, OMRON’s blade pins, which are formed by depositing metal onto a mold plate using the EFC process technology, are plate-shaped, so they can be arranged at a minimum pitch of 0.175mm. OMRON’s testing sockets meet the narrow pitch needs of inspection products which are becoming increasingly multifunctional due to high-density mounting.
OMRON’s blade pin
Plate shape enables narrower pitches.
Minimum pitch width of 0.175mm
Pogo pin
Cylindrical shape makes it difficult to narrow the pitch compared to plate-shaped blade pins.
Minimum pitch width of 0.35mm
High frequency is one of the most important technologies in the mobile communication field. Electronic equipment all around us such as wireless LANs, cellular phones, and GPS are full of high-frequency circuits. Naturally, the equipment used to inspect them is also required to have excellent high-frequency characteristics. OMRON’s high frequency compatible sockets can handle up to 43.5GHz frequency band.
We propose a path length that has sufficient stroke length.
*Specifications are for reference only and may vary depending on the customized product.
OMRON’s high-frequency compatible sockets can handle up to 43.5GHz frequency band. The key to enhancing high-frequency characteristics is to eliminate contact resistance as much as possible. Since general pogo pins are composed of multiple parts, they tend to have high internal resistance and poor high-frequency characteristics. However, OMRON’s high-frequency pins can be manufactured in a single component using a processing method unique to the EFC process technology. Excellent high-frequency characteristics can be achieved because there is no contact resistance between the contacting parts of the components.
Custom design recommendations that best suit the customer’s application and OMRON’s original material blend* make our sockets more than five times more durable than pogo-pin sockets. This greatly reduces the frequency of testing socket replacement at the inspection site, contributing to improved production efficiency.
*Patent No. 5077479
The need for high-capacity equipment is steadily increasing, and the equipment that inspects the equipment is also required to handle high capacities. OMRON’s high-current compatible sockets have a long mechanical durability of 500,000 times or more and can handle high currents of 2.5A DC or higher. A wide range of variations are available to expand the scope of customer inspections.
*Specifications are for reference only and may vary depending on the customized product.
OMRON’s high-current type can handle up to 2.5A DC using a single pin, and up to 10A DC by adopting a bundle structure with multiple pins connected. It can be used for inspection of power semiconductors such as QFN (quad flat non-leaded) packages.
In order to achieve a large current while ensuring sufficient spring property, the high-current type uses a multiple-spring structure where multiple springs are connected using a manufacturing method unique to the EFC process technology. Larger and thicker pins can handle larger current, but this will result in poor spring property, leading to reduced contact accuracy and durability. The multiple-spring structure provides the same conduction area as a single-spring, and the design of providing space allows for flexible movement inside the pin while accommodating large currents.
OMRON conducts duty ratio tests on high current sockets to evaluate their performance. OMRON’s high-current type has the ability to handle even larger currents under a low duty ratio (when the current flow time is short). Semiconductor testing is only used to check for continuity and is not used in such a way that a large current is applied for a long period of time. Under low duty ratio, OMRON’s high-current type can also be used to inspect power semiconductors with specifications of several tens of amperes, which is considered to be in the ultra-high current range in the semiconductor industry. Please consider adopting OMRON’s high-current type.
There are probably many customers who use Kelvin connection measurement (four-terminal measurement) for the inspection of power semiconductor products that handle large currents. The larger the current, the higher the contact resistance, and the more difficult it is to accurately measure the specifications of the device under test. The Kelvin connection separates the terminals for current measurement from those for voltage measurement, allowing accurate measurement of the resistance of the device under test without being affected by lead resistance or contact resistance.
Since Kelvin measurement requires that the current-measuring pin and the voltage-measuring pin are in contact with the same terminal, it is important that both pins are properly insulated to ensure safe use. OMRON’s high-current compatible type also offers sockets with pins equipped with insulating films.
In general, as the number of pins available for measurement increases, it becomes possible for larger currents to be measured and inspected. Pogo pins are cubic in shape, so they require more mounting space than plate-shaped pins. This makes it difficult to press multiple pins against a very small terminal (electrode pad) for inspection.
In addition, the isolation distance must be secured to allow larger currents to flow. Therefore, with typical Kelvin compatible sockets, the challenge is how to apply multiple pins to a high-current, small-package device under test.
OMRON’s high temperature compatible type blade pins are plate-shaped and very slim. Since more test pins can be applied to one terminal (electrode pad), it is possible to handle larger currents than with common Kelvin compatible sockets. Furthermore, the blade pins have an insulating film, which allows space-saving design without taking up a large insulating space, even when used at high currents.
Conventional Kelvin compatible sockets require the current and voltage pins to be placed separately in some cases affects the design of the device under test and measurement equipment, such as the layout of terminals. However, OMRON’s Kelvin compatible sockets allow the current and voltage pins to be placed separately within the same bundle by simply flipping the pins. This can contribute to a reduction in the customer’s design and manufacturing man-hours
The pins for measuring current and voltage can be easily separated by simply flipping the terminals, making design and production easier.
Pins for measuring current and voltage are mixed, making design and production difficult.
Custom design recommendations that best suit the customer’s application and OMRON’s original material blend* make our sockets more than five times more durable than pogo-pin sockets. This greatly reduces the frequency of testing socket replacement at the inspection site, contributing to improved production efficiency.
Electronic devices such as MLCCs, crystal oscillators, and surface acoustic wave filters are very small, some about 1/10th the size of a grain of rice. When inspection pins were applied to these products, it was difficult to perform highly accurate continuity inspections because the tip of each testing pin was extremely thin, resulting in variations in measurement values. To make matters worse, the terminals of the device under test are often made of ceramic and are very hard, so the tips of the testing pins were scraped. This resulted in a short life span and increased maintenance frequency, thereby reducing production efficiency. There was also a problem that the broken pin could damage the device under test itself.
OMRON’s high hardness compatible sockets can be used safely for such extremely small package products.
*Specifications are for reference only and may vary depending on the customized product.
OMRON’s ultra-small package compatible sockets have a convex tip shape to ensure a sufficient contact area with the conduction pad. The strength of the EFC process technology is its ability to control the dimensional tolerances of this tip shape in micron order with extremely small pins and even in mass production.
In addition, the material of the terminals (electrode pads) of small devices under test such as crystal oscillators is often ceramic, and the surface is uneven. Therefore, there are cases where it is difficult to accurately measure the movement of vertical pins such as pogo pins. However, due to the movement of the spring that is unique to the EFC process technology, OMRON’s blade pins make contact in such a way that the pin rubs the terminal surface rather than making contact in a vertical direction. This makes it possible to offer products with reliable contact and stable measurement accuracy.
Omron’s probe pin (blade pin) movement for reliable contact
The convex tip shape greatly reduces damage to the pin tip. OMRON’s blade pins reduce maintenance man-hours in the mass production process and contribute to increased production efficiency.
Furthermore, the blade pins greatly reduce the risk of damaging the customer’s product due to breakage of the tip, enabling stress-free inspections.
Custom design recommendations that best suit the customer’s application and OMRON’s original material blend* make our sockets more than five times more durable than pogo-pin sockets. This greatly reduces the frequency of testing socket replacement at the inspection site, contributing to improved production efficiency.
*Patent No. 5077479
High measurement accuracy is achieved even for small sized SOP (small outline package) without damaging the device under test.
*Specifications are for reference only and may vary depending on the customized product.
When measuring small devices under test, such as SOPs, frame deformation caused by the contact of testing pins is a challenge due to the fragility of the lead frame. OMRON’s SOP compatible sockets use blade pins that are structured to clamp the lead frame of the device under test from both sides.
Stress is hard to be applied, preventing deformation and damage of the lead frame during inspection.
Gently clamp the lead frame of the device under test from both sides with blade pins to prevent deformation and damage to the lead frame.
The lead frame is deformed because the rod-shaped hard testing pin is pressed against the fragile lead frame.
In the case of small and wobbly devices under test, such as an SOP package, it is difficult to accurately inspect each terminal by pressing a rod-shaped pogo pin against the terminal. OMRON’s SOP compatible type contacts the lead frame in such a way as to clamp it from both sides, enabling the testing pin to be pressed with accurate and sufficient contact force even for an SOP sized device under test. The SOP compatible type provides stable electrical contact and highly accurate measurements.
Stable contact is achieved by clamping the lead frame of the device under test from both sides with blade pins.
The terminal on the inspection side is rod-shaped and makes point contact, so it is difficult to accurately bring into contact the terminal to the lead frame of the small and wobbly device under test.
OMRON’s SOP-compatible sockets are five times more durable than pogo-pin sockets, due to OMRON’s original material blend* and custom design proposals that are suitable for customers’ applications. This greatly reduces the frequency of testing socket replacement at the inspection site, contributing to improved production efficiency.
*Patent No. 5077479
OMRON offers socket types that can be used in high temperature environments up to 200°C. The socket types can be used safely for a long period of time in burn-in tests, etc., where initial failures are eliminated in advance by applying temperature and voltage loads. Furthermore, with the same size design as pogo pins, it is possible to replace currently used pogo pins.
*Specifications are for reference only and may vary depending on the customized product.
Pogo pins generally have a spring inside. Therefore, when used at high temperatures, depending on the combination of materials, the inner spring and outer housing may be welded together. However, OMRON’s high temperature compatible type testing pins have a structure that is resistant to welding by placing a spring made of heat-resistant material outside of the pin. The high temperature compatible type has a contact resistance of 100mΩ or less even after 500,000 operations at a high temperature of 180°C. Accurate inspections can be performed even in high temperature environments without being affected by contact resistance or mechanical life.
Pogo pins are basically composed of plunger, spring, and barrel designs, and conduction occurs when the plunger and spring come into contact with each other. Therefore, contactability is dependent on the movement of the spring. OMRON’s high temperature compatible type conducts electricity when the upper plunger and the lower plunger come into contact with each other. The contact structure is such that the lower plunger clamps the upper plunger from both sides, ensuring sufficient contact force. The stable contact ensures accurate inspections without being affected by variations in contact resistance.
The contact structure where the upper plunger sandwiches the lower plunger from both sides ensures stable contact.
The contact is unstable because it depends on the movement of the spring in a structure which conducts electricity when the spring and plunger come into contact with each other.
OMRON’s SOP-compatible sockets are five times more durable than pogo-pin sockets, due to OMRON’s original material blend* and custom design proposals that are suitable for customers’ applications. This greatly reduces the frequency of testing socket replacement at the inspection site, contributing to improved production efficiency.
*Patent No. 5077479